IN EML | ||
MACHINE NAME | IT DOES: | AREA: |
ALD ![]() |
Atomic layer deposition | vacuum deposition |
asher | plasma PR stripper | |
dektak | mechanical surface profilometer | |
ebeam-AJA ![]() |
e-beam evaporator | deposition |
ma-4 | mask alignment, UV exposure of photo resist | |
OxidationTube ![]() |
CMOS oxidation furnace | diffusion |
plasmatherm | PECVD-RIE | plasma etch |
RTA-EML![]() |
rapid thermal processing | |
sputtererAJA ![]() |
thin film deposition | |
anneal-furnace ![]() |
tube anneal furnace | diffusion |
vac-oven ![]() |
Up to 600C in 10mT vacuum or N2 purge. | diffusion |