Introduction: |
This system deposits metal Using an electron beam which gives the
purest metal possible. There are three planetaries in the system
that will accommodate fourteen wafers per planetary for a total of
forty two wafers per process. It should be noted that the crucible s
used in the deposition of material be filled to the proper level.
The system is capable of depositing four layers of metal on a
substrate without breaking vacuum, and is also capable of
co-deposition of metal alloy (2 materials at the same time). It is
extremely important that the electron beam be centered on the hearth
to avoid damage to the hearth, the crucible and avoid contamination
of the material.
There are 2 electron beam evatorater in the MTL. One is located
in the TRL (Technology Research Laboratory) and the other is
in the ICL (Integrated Circuits Laboratory). The e-beam in
the ICL is used strictly for silicon devices processing.The
e-beam in the TRL is used for a wide variety of metals, such
as gold, tin, silver, etc. This e-beam must not be used if
your wafer require further processing in equipment or laboratories
that is dedicated to silicon processing. If you need metal
that is compatible to silicon device work then you must used
the e-beam in the ICL. Once you use the e-beam in the TRL you
cannot bring your wafers back into the ICL for any other process
steps. |
Procedure: |
Login to CORAL and engage machine.
Start Up:
- Turn on cooling waters to the hearth and power supply.
Cooling water is located in the back of the system.
Turn on the main supply so the valve handles are
parrell to the pipe. Turn the bypass off valve handle
perpendicular to the pipe.
- Turn on the power supply and
verify the gun filament current is reading correctly, approximately
0.3 amps.
- Check crystal health, parameter 36 on the process
controller. The crystal health should read greater then 85%,
if it does not change crystal.
Chamber Venting:
- Turn on system vent toggle switch.
- Press the stop pump push button.
- System will start venting and will be at atmospheric
pressure in approximately 6 minutes.
Sample Loading:
- Lock the planetary removal tool into place. Remove the
planetary locking bolt and remove the planetary from the
system. Place the planetary on a flat clean surface.
(CAUTION: Do not attempt to load wafers into the
planetary while it is in the system.)
- Remove a sufficient number of dummy wafers and replace
them with the wafer to be metalized. Be sure that the
clip spring is positioned in such a way that it points
directly toward the center of the wafer.
- Inspect the crucible to insure that it contains enough
material for your deposition. Material level in the
crucible must be at one half to three quarters of the volume
of the crucible.
- Remove the shutter from the system and inspect the
underside to insure that there is no flaking. Loose
flake can contaminate the deposition material.
- If flakes are present, clean and place the shutter back
into the system.
- Open the shutter and place the crucible with the
deposition material into the hearth pocket.
- Close the shutter.
- Place the planetary back into the system Using the
planetary tool and lock the planetary securely
into place with the locking bolt. Remove the planetary
tool.
System Pump Down:
- Turn off the system vent toggle switch.
- Press the start pump push button.
- Pump system to 2 E-6 or lower before depositing metal
Note: The system should pump to approximately 5 E-7 in 30 to 45 minutes
Deposition:
- Select the proper deposition process and film number.
Process number and film number are set for the
same values
Example: Process 1 Film 1, refer to the process note book.
- During pump down check all process parameters to insure
they are correct.
- Start planetary rotation. The two rotation toggle
switches should be positioned as follows:
Forward direction and local.
- Turn on the main switch to the power supply.
- Turn on the PC turn key switch.
- Turn on the high voltage push bottom switch and hold it
in place until both relays latch into place.
- Turn on filament push button.
Be sure that you have selected the proper E-gun.
Gun #1 Turret heath (4 pocket
hearth). Gun #2 Single pocket hearth.
- Press the reset push button on the process controller.
- Press start process push button.
Note: If multi layers of metal are required, let the crucible
material cool for a minimum of one
minute before rotating the torrent hearth.
Sample Unloading:
- Deposition complete start timing the 20 minute cool
down cycle.
- Turn off the filament and the high voltage at the power
supply controller. Leave the main circuit breaker on
so the power supply will cool for the same time period as the
samples(20 minutes).
- After the samples and power supply has cooled for the
required 20 minutes, turn off the PC turn key switch
and the main switch for the power supply.
- Press the stop pump push button
- Switch the vent toggle switch to vent
- After system reaches atmospheric pressure remove samples
as describer in Sample Loading steps
a),b),c).
- Remove the planetary/planetaries as described in Sample
Loading step a).
- Open shutter and remove crucible material from the hearth.
and place it in its proper storage
container, and place it back into the dry box. Lock the
dry box.
- Remove the shutter and inspect the underside for flaking
and clean if needed. Replace shutter and return it to
the close position.
- Remove the wafers from the planetary and replace them
with dummy wafers.
- Place planetary/planetaries back into the system and lock
them into position with the locking
bolts.
- Turn off the cooling water. Open the bypass valve
(parallel to the pipe). Turn off
the supply and return valves perpendicular to the pipe.
- Return the system to high vacuum status as follows:
- Turn off vent toggle switch
- Close chamber
- Press start pump push button
- Disengage the machine in CORAL.
|