Modern CMOS processes need new methodologies to extract, characterize, and model process variations and their sources. Much work has been…
A key challenge for putative industrial users of thermal nanoimprint lithography (NIL) is to design mask patterns that can be…
Modeling etch-rate variation in Deep Reactive Ion Etching (DRIE) helps to identify possible defects in MEMS and IC devices arising…
In this work we propose a particle-agglomeration model for CMP, to understand the creation and behavior of agglomerated slurry abrasive…
The within-wafer non-uniformity of the material removal rate has long been a concern in chemical-mechanical planarization (CMP). Pressure distribution is…
Continuous and aggressive scaling has led to increasing variation in process parameters, which are most critical in determining the quality…
Electromechanical resonators such as quartz crystals, surface acoustic wave (SAW) resonators, and ceramic resonators have become essential components in electronic…
The high-frequency variability characterization of MOSFETs is becoming more necessary due to new process developments such as high-K metal gates,…
Design for manufacturability (DFM) of processes, devices, and integrated circuits. Characterization and modeling of variation in semiconductor and MEMS manufacturing, with emphasis on chemical-mechanical polishing (CMP), electroplating, plasma etch, and embossing processes.