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Annual Research Report 2002
Fabrication Technologies
Alternative Chemistries for Wafer Patterning
Scanning-Electron-Beam Lithography
Spatial-Phase-Locked Electron-Beam Lithography
Search for an Optimal Scintillation System for Spatial Phase Locked E-beam Lithography
X-ray Nanolithography
Improved Mask Technology for X-ray Lithography
Nanometer-level Feedback-Stabilized Interferometric Aligning and Gapping X-ray Exposure System
Zone-Plate-Array Lithography (ZPAL) and Microscopy (ZPAM)
Fabricating Advanced Microsystems with Conformable-Contact Photolithography
Interference Lithography
Interference Lithography for Patterning Variable-Period Gratings
Nanometrology Using Interferometrically-Patterned Fiducial Grids
Technologies for 3D Devices and Circuits Through Wafer Bonding with Submicron Alignment Accuracy
A Silicon Substrate-Via Technology with High Aspect Ratio
A Faraday Cage Structure for Substrate Crosstalk Isolation
Selective Self-Organization of Colloidal Particles
Polymeric Fluorocarbon Films via Hot-Filament Chemical Vapor Deposition
Hot Filament Chemical Vapor Deposition of Polyoxymethylene as a Sacrificial Layer for Fabricating Air Gaps
Three-dimensional Integration of GaAs and Si Circuitry Using Low Temperature Oxide Bonding Techniques
Magnetically Assisted Self Assembly A New Heterogeneous Integration Technique
Solid State Solvation Effect
Diffusion and Activation of Arsenic in Silicon Germanium Alloys