MARC2006
January 25-26, 2006
Waterville Valley Conference and Event Center
Session Titles
Please note that this list is subject to change.
Session 1: Circuits & Systems |
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Wireless/Wireline | |
1.01 | 77 GHz Receiver for MM-Wave Imaging |
J.D. Powell, K.M. Nguyen, H. Kim, C.G. Sodini | |
1.02 | A Chipset for a Micro-Power Wireless Sensor Node |
D. Finchelstein, D. Daly, N. Ickes, N. Verma, A. Chandrakasan | |
1.03 | Ultra-Wideband Transceiver Circuits and Systems |
B.P. Ginsburg, N. Ackerman, M. Bhardwaj, R. Blazquez, C.R. Deonier, F.S. Lee, V. Sze, D.D. Wentzloff, A.P. Chandrakasan | |
1.04 | Wireless Giga-Bit Local Area Network |
F. Edalat, L. Khuon, K. Nguyen, J.K. Tan , C.G Sodini | |
1.05 | Chopper Stabilization in Analog Multipliers |
A. Hadiashar, J.L. Dawson | |
Mixed-Signal | |
1.06 | Comparator Based Switched Capacitor Circuits for Scaled CMOS Technologies |
J.K. Fiorenza, T. Sepke, C.G. Sodini P. Holloway, H.-S. Lee | |
1.07 | IMPACT: Massively Parallel Analog-digital Converter Test Chip |
M. Spaeth, H.-S. Lee | |
1.08 | Indirect Background Calibration of Pipelined ADCs via Decision Boundary Gap Estimation (DBGE) |
L.G. Brooks, H.S. Lee, G.W. Wornell | |
Emerging Technology | |
1.10 | Minimum Energy Digital Circuits Using Sub-Threshold Operation |
J.Y.S. Kwong, Y. Ramadass, B. Ginsburg, V. Sze, B. Calhoun, A. Chandrakasan | |
1.11 | Optical Feedback Organic LED Display: Design of Silicon Feedback Circuits and Integration of Organic Components |
K. Ryu, A. Lin, K. Lamba, I. Nausieda, J. Kymissis, V. Bulovic, C.G. Sodini | |
1.12 | Performance and Limitations of 65 nm CMOS for Integrated RF Power Applications |
J. Scholvin, D.R. Greenberg, J.A. del Alamo | |
CAD/Modeling | |
1.13 | Parameterized Model Order Reduction for Nonlinear Dynamical Systems |
B.N. Bond, L. Daniel | |
1.14 | Test Structures and Optimization Methodologies for Electrical Variation in IC |
K. Balakrishnan, D. Lim, N. Drego, K. Gettings, D.S. Boning | |
Session 2: Photonics
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Opto-Electronic Integration | |
2.01 | AlGaAs/GaAs VCSEL Processing and Heterogeneous Integration with Si ICs |
J.M. Perkins, J. Rumpler, II, E. Barkley, C.G. Fonstad | |
2.02 | SiOxNy Waveguides on Si and Optical Coupling to Co-Axial RM3 Integrated Devices |
E. Barkley, C.G. Fonstad, J. Rumpler, J. Perkins, S. Famini | |
2.03 | Highly Integratable In-plane Laser Diodes for Optoelectronic Integration |
J.J. Rumpler, II, C.G. Fonstad, Jr. | |
2.04 | Integration of Waveguide and Photodetector for Silicon Based Microphotonics Chip |
D. Ahn, C.-Y. Hong, J. Michel, L.C. Kimerling | |
2.05 | Precision Nanofabrication of Integrated Photonic Devices |
C.W. Holzwarth, R. Barreto, T. Barwicz, H.I. Smith | |
Photodetectors | |
2.07 | CMOS-compatible Photodetectors Using Ge-on-Si films Deposited in an Applied Materials Epitaxial Reactor |
O.O. Olubuyide, M. Kim, D.T. Danielson, J. Liu, J. Yasaitis, L.C. Kimerling, J.L. Hoyt | |
2.08 | High-Performance, Tensile-Strained Ge P-I-N Photodetectors on a Si Platform |
J. Liu, J. Michel, W. Giziewicz, D. Pan, K. Wada, D.D. Cannon, S. Jongthammanurak, D.T. Danielson, L.C. Kimberling | |
Photonic Crystals & Applications | |
2.10 | Localized Propagation Modes Guided by Shear Discontinuities in Photonic Crystals |
K. Tian, G. Barbastathis | |
2.11 | New Solar Cells with Novel Textured Photonic Crystal Backreflector for Light Trapping |
L. Zeng, Y. Yi, C. Hong, B.A. Alamariu, J. Liu, X. Duan, L.C. Kimerling | |
MOEMS | |
2.12 | MEMS Switching and Tuning of Integrated Optical Ring Resonators |
S. Takahashi, D. Seneviratne, G. Barbastathis | |
Holography | |
2.13 | Volume Holographic Imaging with Natural and Supercontinuum Illumination |
W. Sun, S. Oh, K. Tian, Z. Xu, G. Barbastathis | |
Session 3: MEMS |
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Printing | |
3.01 | A Second Generation Micromachined Printhead for the Direct Evaporative Patterning of Organic Materials |
V. Leblanc, J. Chen, V. Buloviç, M.A. Schmidt | |
Microchemical Systems | |
3.02 | A MEMS Singlet Oxygen Generator |
T. Hill, B. Wilihite, L. Velasquez-Garcia, A. Epstein, K. Jensen, C. Livermore | |
3.03 | A Linear Quadrupole for Mass Spectroscopy with a Meso-Scaled Deflection Spring Assembly System |
L.F. Velasquez-Garcia, A.I. Akinwande | |
Power MEMS | |
3.04 | An Integrated Multiwatt Permanent Magnet Turbine Generator |
B.C. Yen, M. Allen, F.F. Ehrich, A.H. Epstein, F. Herrault, L.C. Ho, S. Jacobson, J.H. Lang, H. Li, Z.S. Spakovszky, C.J. Teo, D. Veazie | |
3.05 | A Low Contact Resistance MEMS Relay |
A.C. Weber, J.H. Lang, A.H. Slocum | |
3.06 | A Fully Micro-Fabricated Planar Array of Electrospray Emitters for Space Propulsion Applications |
B. Gassend, L.F. Velasquez-Garcia, A.I. Akinwande, M. Martinez-Sanchez | |
3.07 | Micro Reaction Technology for Thermally Efficient Energy Conversion |
B. Blackwell, K. Deshpande, O. Nielsen, M.A. Schmidt, K. Jensen | |
Fabrication | |
3.08 | Characterization, Modeling and Design Optimization of Plasma Etch Variations |
K.O. Abrokwah, H.K. Taylor, A. Farahanchi, S.P. Vudathu, D.S. Boning | |
3.09 | Dynamic Modeling of CMP and Electroplating Processes |
H. Cai, D. Truque, X. Xie, D. Boning | |
Session 4: BioMEMS |
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Cell Manipulation | |
4.01 | Micromechanical Control of Cell-Cell Interaction |
E.E. Hui, S.N. Bhatia | |
4.02 | A Conductivity-Specific, Continuous Micro-Organism Separator |
M.D. Vahey, J. Voldman | |
4.03 | Microfluidic/Dielectrophoretic Approaches to Selective Microorganism Concentration |
K. Puchala, H.-Y. Lee, J. Voldman | |
4.04 | A Multilayered Microfluidic Device for Combinatorial Tissue Biology in Vitro |
D.T. Eddington, S.N. Bhatia | |
4.05 | A Microfabricated Platform for Investigating Multicellular Organization in 3-D Microenvironmentsnments |
D.R. Albrecht, R.L. Sah, S.N. Bhatia | |
Biomolecule Manipulation | |
4.06 | High Speed Continuous Fractionation of Proteins in a Nanofilter Array Chip |
J. Fu, J. Han | |
4.07 | Generation of Supported Lipid Bilayer and Vesicle Arrays for Study of Sphingomyelinase-Lipid Membrane Interaction |
L. Chao, A.P. Gast | |
4.08 | Continuous-Flow pI-Based Sorting of Proteins and Peptides in a Microfluidic Chip using Diffusion Potential |
Y.A. Song, J. Han | |
Session 5: Molecular & Nanotechnology |
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Carbon Nanotubes | |
5.01 | Carbon Nanotube Assembly for Interconnect and Device Applications |
T.M. Wu, B. Long, R. Reif, F. Stellacci | |
5.02 | CVD Synthesis of Aligned Carbon Nanotubes for Interconnect Applications |
A. Reina Cecco, M. Hofmann, H. Son, J. Kong | |
5.03 | Rapid and Shape-Controlled Growth of Aligned Carbon Nanotube Structures |
A.J. Hart, L.C. van Laake, O. Yaglioglu, A.H. Slocum | |
5.04 | Single-Gated CNT Arrays for Electron Impact Ionization and Field Ionization |
L.F. Velasquez, A.I. Akinwande | |
Nanofabrication | |
5.05 | Analysis, Design, and Optimization of Nanostructured Origami |
P. Stellman, N. Shaar, T. Nichol, G. Barbastathis | |
5.06 | Materials and Processes for Nanostructured Origami |
W.J. Arora, H.J. In, T. Nichol, G. Barbastathis | |
5.07 | AC Field Directed Assembly of Gold Nanoparticles into Nano-Gaps |
R. Barsotti, R. Wartena, F. Stellacci, Y. Chiang | |
5.08 | Achieving Nanometer Overlay in Imprint Lithography |
E.E. Moon, H.I. Smith | |
NEMS | |
5.09 | Vertical Nano-Relays |
K.M. Milaninia, M.A. Baldo | |
Session 6: Electronic Devices & Emerging Technologies |
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Beyond CMOS | |
6.01 | Potential of InGaAs HEMTs as a Beyond-CMOS Logic Technology |
D.-H. Kim, J.A. del Alamo | |
6.02 | Electrical Characteristics of Germanium MOSFETs with High-K Dielectrics |
A. Ritenour, R.Z. Lei, A. Khakifirooz, K. Kim, R. Gordon, D.A. Antoniadis | |
6.03 | Effect of Biaxial and Uniaxial Strain on the Mobility in Ultrathin SOI and GOI |
A. Khakifirooz, I. Lauer, D. A. Antoniadis | |
6.04 | Interdiffusion in SiGe/Si Epitaxial Heterostructures |
G. Xia, J.L. Hoyt | |
6.05 | Mobility Modeling and Electrostatics of Heterostructure-on-Insulator FETs |
O.M. Nayfeh, C. Ní Chléirigh, I. Åberg, J.L. Hoyt, D.A. Antoniadis | |
Organic Electronics | |
6.06 | Threshold Voltage in Pentacene O-TFTs |
A.I. Wang, J. Kymissis, V. Bulovic, A.I. Akinwande | |
6.07 | Oxidatively initiated Chemical Vapor Deposition of PEDOT |
S.G. Im, K.K. Gleason | |
Interconnects | |
6.08 | Through-Substrate Interconnects for Millimeter-Wave
Mixed-Signal Systems |
J.H. Wu, J.A. del Alamo | |
Fuel Cells | |
6.09 | Microfabricated Fuel Cell Electrodes for Studying Oxygen Reduction |
Y. Shao-Horn, G.J. la O' | |
Opto-Electronic Communication | |
6.10 | Photonic Crystals for IR and NIR Applications |
N. Jovanovic, I. Celanovic, D. Perreault, T. Keim, J. Kassakian | |
Next Generation Displays | |
6.11 | Double-Gated Carbon Nano Fibers Field Emission and Field Ionization Arrays |
L.-Y. Chen, B.Adeoti, L.F. Velasquez-Garcia, A.I. Akinwande | |
Microfabrication | |
6.12 | Germanium-on-Insulator Fabrication by Wafer Bonding and Layer Transfer |
J. Hennessy, D.A. Antoniadis | |
6.13 | Raised Source/Drain Technology for Ultra-thin Fully Depleted SOI |
L. Gomez, C. Chen, J.A. Burns, J.L. Hoyt | |
6.13a | Microelectronic Thin Films Handling and Transfer Using Low Temperature Wafer Bonding |
A. Fan, A. Somani, C.S. Tan, R. Reif | |
6.14 | Processing Ge in the MTL Fabs |
B. Alamariu, B. McKenna |