{"id":1924,"date":"2013-08-14T16:50:12","date_gmt":"2013-08-14T16:50:12","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/?p=1924"},"modified":"2013-08-23T22:20:55","modified_gmt":"2013-08-23T22:20:55","slug":"carl-v-thompson","status":"publish","type":"post","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/carl-v-thompson\/","title":{"rendered":"Carl V. Thompson"},"content":{"rendered":"<h3>Collaborators<\/h3>\n<ul>\n<li>W. Bao, Prof. \u00a0National<\/li>\n<li>U. of Singapore (NUS)<\/li>\n<li>W.C. Carter, Prof., MIT<\/li>\n<li>W.K. Choi, Prof.,, NUS<\/li>\n<li>J.A. del Alamo, Professor, MIT<\/li>\n<li>B.M. Gallant, student, MechE, MIT<\/li>\n<li>R. Enright, postdoc, MechE, MIT<\/li>\n<li>F. Gao, student, EECS, MIT<\/li>\n<li>C.L. Gan, Prof., Nanyang Technical University<\/li>\n<li>G.D. Nessim, Lecturer, Bar-Ilan U.<\/li>\n<li>T. Palacios, Prof., EECS, MIT<\/li>\n<li>W. Sasangka, Postdoc, SMART<\/li>\n<li>Y. Shao-Horn, Prof. MSE,<\/li>\n<li>Mech. E, MIT<\/li>\n<li>D.J. Srolovitz, Prof., U. Penn.<\/li>\n<li>S.C. Tan, Postdoc, MSE, MIT<\/li>\n<li>E.N. Wang, Prof., MechE, MIT<\/li>\n<li>K. Wang, Postdoc, SMART<\/li>\n<\/ul>\n<h3>Graduate Students<\/h3>\n<ul>\n<li>A. Al-Obeidi, NSF Fellow, MSE<\/li>\n<li>T. Batcho, Res. Asst., MSE<\/li>\n<li>G. H. Kim, Res. Asst., MSE<\/li>\n<li>C.Q. Lai, SMA Fellow, NUS<\/li>\n<li>D. Li, Res. Asst. MSE<\/li>\n<li>P. Lianto SMA Fellow, NUS<\/li>\n<li>R. Mitchell, Res. Asst., MSE<\/li>\n<li>H. Yu, Res. Asst., MSE<\/li>\n<li>Z. Wen, Res. Asst., MIT<\/li>\n<li>L.T. Ye, SMA Fellow, SMART<\/li>\n<li>H. Zhao, Res. Asst., MechE<\/li>\n<li>R. Zucker, Res. Asst., MSE<\/li>\n<li>D. Perego, Visiting Student, MSE<\/li>\n<\/ul>\n<h3>Support Staff<\/h3>\n<ul>\n<li>K. Fitzgerald, Admin. Asst. II<\/li>\n<\/ul>\n<h3>Publications<\/h3>\n<p>R.I. Made, C.L. Gan, L. Yan, K.H. Boon Kor, H.L. Chia, K.L. Pey, and C.V. Thompson, <i>Experimental characterization and modeling of the mechanical properties of Cu\u2013Cu thermocompression bonds for three-dimensional integrated circuits<\/i>, Acta Materialia 60, 578 (2012).<\/p>\n<p>L. Li, J. Joh, J.A. del. Alamo, and C.V. Thompson,<i>Spatial distribution of structural degradation under high-power stress in AlGaN\/GaN HEMTs<\/i>, Appl. Phys. Letts. 100, 172109 (2012).<\/p>\n<p>G.D. Nessim, A. Al-Obeidi, H. Grisaru, E.S. Polsen, C.R. Oliver, T. Zimrin, A.J. Hart, D. Aurbach, and C.V. Thompson,<i> Enhanced synthesis of vertically aligned carbon nanotubes via in-situ generation of water vapor by preheating of added oxygen, <\/i>Carbon <b>50<\/b>, 4002 (2012).<\/p>\n<p>C.V. Thompson<i>, Solid State Dewetting of Thin Films<\/i>, Ann. Rev. of Materials Research 42, 299-334 (2012).<\/p>\n<p>A.L. Giermann and C.V. Thompson, <i>Three-dimensional graphoepitaxial alignment resulting from solid-state dewetting of Au films on surfaces with monoperiodic topography<\/i>, Applied Physics Letters 101, 051904 (2012).<\/p>\n<p>W. Jiang, W. Bao, C.V.Thompson, and D.J. Srolovitz, <i>Phase Field Approach for Simulating Solid-State Dewetting Problems<\/i>, Acta Materialia 60, 5578\u20135592 (2012).<\/p>\n<p>C.Q. Lai, C.V. Thompson, and W.K. Choi, <i>Uni-, Bi- and Tri-Directional Wetting Caused by Nanostructures with Anisotropic Surface Energies<\/i>, Langmuir 28(30), 11048\u201311055 (2012).<\/p>\n<p>F. Gao, D. Chen, B. Lu, H.L. Tuller, C.V. Thompson, S. Keller, U.K. Mishra, and T. Palacios<i>, Impact of Moisture and Fluorocarbon Passivation on the Current Collapse of AlGaN\/GaN HEMTs<\/i>, Electron Device Letters 33, 1378 \u2013 1380 (2012).<\/p>\n<p>R. Enright, N. Miljkovic, A. Al-Obeidi, C.V. Thompson, and E.N. Wang,<i>Superhydrophobic condensation: The role of pinning barriers and size-scale<\/i>, Langmuir 28, 1442 (2012).<\/p>\n<p>B.M. Gallant, R.R. Mitchell,\u00a0D.G. Kwabi, J. Zhou, L. Zuin, C.V. Thompson, and Y. Shao-Horn, <i>Chemical and Morphological Changes of Li-O<sub>2<\/sub> Battery Electrodes Upon Cycling, <\/i>J. Phys. Chem. C 116(39), 20800-20805 (2012).<\/p>\n<p>P. Lianto, S. Yu, J. Wu, C.V. Thompson and W.K. Choi, <i>Vertical etching with isolated catalysts in metal-assisted chemical etching of silicon<\/i>,<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Processing and property optimization of thin films and nanostructures for applications in electronic , micorelectromechanical, and  electromechanical devices and systems. Interconnect and device reliability.<\/p>\n","protected":false},"author":370,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[80],"tags":[69],"_links":{"self":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/posts\/1924"}],"collection":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/users\/370"}],"replies":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/comments?post=1924"}],"version-history":[{"count":3,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/posts\/1924\/revisions"}],"predecessor-version":[{"id":2482,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/posts\/1924\/revisions\/2482"}],"wp:attachment":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/media?parent=1924"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/categories?post=1924"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/tags?post=1924"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}