{"id":1635,"date":"2013-07-25T18:30:30","date_gmt":"2013-07-25T18:30:30","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/?p=1635"},"modified":"2013-08-06T19:52:44","modified_gmt":"2013-08-06T19:52:44","slug":"vertical-junction-silicon-microdisk-modulators-at-25gbs","status":"publish","type":"post","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/vertical-junction-silicon-microdisk-modulators-at-25gbs\/","title":{"rendered":"Vertical Junction Silicon Microdisk Modulators at 25Gb\/s"},"content":{"rendered":"
High-performance computing systems require high bandwidth, low power, and scalable optical interconnects to maintain balanced communications in future exascale machines. Low-power, low-voltage, high-speed, and compact CMOS-compatible silicon electro-optic modulators are key enablers for next generation optical interconnects. Silicon modulators based on the free-carrier effect in silicon achieve high-speed modulation by injecting or depleting charge, inducing a frequency shift in a Mach-Zehnder interferometer or resonant device that translates the resultant frequency shift into an amplitude response. Resonant modulators confine light in compact high-Q devices, enhancing the interaction of the light with the change in charge distribution. Compact resonant devices also minimize the device capacitance, enabling high-speed and low power modulators. In previous record-setting demonstrations, vertical p-n<\/i> junction devices have achieved error-free modulation up to 12.5Gb\/s with only a 1V drive and while consuming only 3fJ\/bit[1<\/a>]<\/sup>.<\/p>\n