{"id":1182,"date":"2013-06-28T20:09:29","date_gmt":"2013-06-28T20:09:29","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/files\/2013\/06\/yu_tunnelfets_02.jpg"},"modified":"2013-06-28T20:09:29","modified_gmt":"2013-06-28T20:09:29","slug":"yu_tunnelfets_02","status":"inherit","type":"attachment","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/fabrication-technology-for-ingaasgaassb-vertical-tunnel-fets\/yu_tunnelfets_02\/","title":{"rendered":"Figure 2"},"author":370,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"description":{"rendered":"<p class=\"attachment\"><a href='https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02.jpg' rel=\"lightbox[1182]\"><img width=\"300\" height=\"188\" src=\"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-300x188.jpg\" class=\"attachment-medium size-medium\" alt=\"\" loading=\"lazy\" srcset=\"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-300x188.jpg 300w, https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-220x138.jpg 220w, https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02.jpg 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/a><\/p>\n"},"caption":{"rendered":"<p>Figure 2: Left: Proposed process flow for the InGaAs\/GaAsSb vertical T-FET. Right: SEM micrograph of the fabricated air-bridge structure after a selective wet etch.<\/p>\n"},"alt_text":"","media_type":"image","mime_type":"image\/jpeg","media_details":{"width":800,"height":502,"file":"2013\/06\/yu_tunnelfets_02.jpg","sizes":{"thumbnail":{"file":"yu_tunnelfets_02-150x150.jpg","width":150,"height":150,"mime_type":"image\/jpeg","source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-150x150.jpg"},"medium":{"file":"yu_tunnelfets_02-300x188.jpg","width":300,"height":188,"mime_type":"image\/jpeg","source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-300x188.jpg"},"post-thumbnail":{"file":"yu_tunnelfets_02-150x150.jpg","width":150,"height":150,"mime_type":"image\/jpeg","source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-150x150.jpg"},"abstract-thumb":{"file":"yu_tunnelfets_02-220x138.jpg","width":220,"height":138,"mime_type":"image\/jpeg","source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02-220x138.jpg"},"full":{"file":"yu_tunnelfets_02.jpg","width":800,"height":502,"mime_type":"image\/jpeg","source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02.jpg"}},"image_meta":{"aperture":0,"credit":"","camera":"","caption":"","created_timestamp":0,"copyright":"","focal_length":0,"iso":0,"shutter_speed":0,"title":""}},"post":1178,"source_url":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-content\/blogs.dir\/22\/files\/2013\/06\/yu_tunnelfets_02.jpg","_links":{"self":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/media\/1182"}],"collection":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/media"}],"about":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/types\/attachment"}],"author":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/users\/370"}],"replies":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2013\/wp-json\/wp\/v2\/comments?post=1182"}]}}