{"id":6160,"date":"2012-07-17T22:25:52","date_gmt":"2012-07-17T22:25:52","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/?p=6160"},"modified":"2012-08-14T15:05:48","modified_gmt":"2012-08-14T15:05:48","slug":"duane-s-boning","status":"publish","type":"post","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/duane-s-boning\/","title":{"rendered":"Duane S. Boning"},"content":{"rendered":"<h3>Collaborators<\/h3>\n<ul>\n<li>A. Elfadel, Masdar Institute<\/li>\n<li>A. Philipossian, Univ. of Arizona<\/li>\n<li>H. Taylor, NTU, Singapore<\/li>\n<\/ul>\n<h3>Graduate Students<\/h3>\n<ul>\n<li>K. Balakrishnan, Res. Asst., EECS<\/li>\n<li>A. Chang, Res. Asst., EECS<\/li>\n<li>W. Fan, Res. Asst., EECS<\/li>\n<li>C. GoGwilt, Res. Asst., EECS<\/li>\n<li>J. Lee, Res. Asst., EECS<\/li>\n<li>J. Johnson, Res. Asst., EECS<\/li>\n<li>L. Yu, Res. Asst., EECS<\/li>\n<\/ul>\n<h3>Support Staff<\/h3>\n<ul>\n<li>G. Lindsay, Admin. Asst. II<\/li>\n<li>M. Whiting, Admin. Asst. II<\/li>\n<\/ul>\n<h3>Publications<\/h3>\n<p>N. Drego,\u00a0 A. Chandrakasan, D. Boning, and D. Shah, \u201cReduction of Variation-Induced Energy Overhead in Multi-core Processors,\u201d <span style=\"text-decoration: underline;\">IEEE Transactions on Computer-Aided Design<\/span>, vol. 30, no. 6, pp. 891-904, June 2011.<\/p>\n<p>H. Taylor, K. Smistrup, and D. Boning, \u201cModeling and simulation of stamp deflections in nanoimprint lithography: exploiting backside grooves to enhance residual layer thickness uniformity,\u201d <span style=\"text-decoration: underline;\">Microelectronic Engineering<\/span>, vol. 88, no. 8, pp. 2154-2157, August 2011.<\/p>\n<p>H. Taylor, D. Boning, and C. Iliescu, \u201cA razor-blade test of the demolding energy in a thermoplastic embossing process,\u201d <span style=\"text-decoration: underline;\">Journal of Micromechanics and Microengineering<\/span>, vol. 21, no. 6, p. 067002, June\u00a0 2011.<\/p>\n<p>R. K. Jena, H. K. Taylor, Y. C. Lam, D. S. Boning, and C. Y. Yue, \u201cEffect of polymer orientation on pattern replication in a micro-hot embossing process: experiments and numerical simulation,\u201d <span style=\"text-decoration: underline;\">Journal of Micromechanics and Microengineering<\/span>, vol. 21, no. 6, p. 065007, June\u00a0 2011.<\/p>\n<p align=\"left\">A. H. Chang, D. Boning, and H.-S. Lee, \u201cRedundancy in SAR ADCs,\u201d <span style=\"text-decoration: underline;\">Great Lakes Symposium on Very Large Scale Integration (GLSVLSI)<\/span>, Lausanne, Switzerland, May 2011.<\/p>\n<p align=\"left\">K. Balakrishnan, K. A. Jenkins, and D. Boning, \u201cA Ring Oscillator-Based Test Structure for AC Variability Characterization of Individual MOSFETs,\u201d <span style=\"text-decoration: underline;\">2<sup>nd<\/sup> European Workshop on CMOS Variability (VARI)<\/span>, 4 pages, Grenoble, France, May 2011.<\/p>\n<p>W. Y. Zhang, X. Li, R. Rutenbar, K. Balakrishnan, and D. Boning, \u201cToward Efficient Spatial Variation Decomposition via Sparse Regression,\u201d <span style=\"text-decoration: underline;\">IEEE International Conference on Computer-Aided Design (ICCAD)<\/span>, Nov. 2011.<\/p>\n<p>W. Fan, D. Boning, Y. Zhuang, Y. Sampurno, A. Philipossian, M. Moinpour and D. Hooper, \u201cCharacterization of CMP Pad Surface Properties and Aging Effects,\u201d <span style=\"text-decoration: underline;\">International Conference on Planarization Technology (ICPT),<\/span> Seoul, Korea, Nov. 2011.<\/p>\n<p>J. Johnson, D. Boning, G.-S. Kim, R. Mudhivarthi, P. Safier, and K. Pate, \u201cSlurry Particle Agglomeration Model for Chemical Mechanical Planarization (CMP),\u201d <span style=\"text-decoration: underline;\">International Conference on Planarization Technology (ICPT),<\/span> Seoul, Korea, Nov. 2011.<\/p>\n<p>A. H. Chang, K. Zuo, J. Wang, D. Yu, and D. Boning, \u201cTest Structure, Circuits and Extraction Methods to Determine the Radius of Influence of STI and Polysilicon Pattern Density,\u201d <span style=\"text-decoration: underline;\">IEEE International Symposium on Quality Electronic Design (ISQED)<\/span>, March 2012.<\/p>\n<p>L. Yu, W.-Y. Chang, K. Zuo, J. Wang, D. Yu, and D. Boning, \u201cMethodology for Analysis of TSV Stress Induced Transistor Variation and Circuit Performance,\u201d <span style=\"text-decoration: underline;\">IEEE International Symposium on Quality Electronic Design (ISQED)<\/span>, March 2012.<\/p>\n<p>W. Zhang, K. Balakrishnan, X. Li, D. Boning, E. Acar, F. Liu, and R. A. Rutenbar, \u201cSpatial Variation Decomposition via Sparse Regression,\u201d <span style=\"text-decoration: underline;\">International Conference on IC Design and Technology (ICICDT),<\/span> Austin, TX, May 2012.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Design for manufacturability (DFM) of processes, devices, and integrated circuits. Characterization and modeling of variation in semiconductor and MEMS manufacturing, with emphasis on chemical-mechanical polishing (CMP), electroplating, plasma etch, and embossing processes. Statistical modeling of spatial and operating variation in advanced devices and circuits.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[80],"tags":[44],"_links":{"self":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/posts\/6160"}],"collection":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/comments?post=6160"}],"version-history":[{"count":8,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/posts\/6160\/revisions"}],"predecessor-version":[{"id":6711,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/posts\/6160\/revisions\/6711"}],"wp:attachment":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/media?parent=6160"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/categories?post=6160"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2012\/wp-json\/wp\/v2\/tags?post=6160"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}