{"id":3806,"date":"2011-07-13T14:34:58","date_gmt":"2011-07-13T14:34:58","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/?p=3806"},"modified":"2011-07-19T18:42:08","modified_gmt":"2011-07-19T18:42:08","slug":"duane-s-boning","status":"publish","type":"post","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/duane-s-boning\/","title":{"rendered":"Duane S. Boning"},"content":{"rendered":"<div class=\"pf-content\"><h3>Collaborators<\/h3>\n<ul>\n<li>Y.-C. Lam, NTU, Singapore<\/li>\n<li>A. Philipossian, Univ. of Arizona<\/li>\n<\/ul>\n<h3>Graduate Students<\/h3>\n<ul>\n<li>K. Balakrishnan, Res. Asst., EECS<\/li>\n<li>A. Chang, Res. Asst., EECS<\/li>\n<li>W. Fan, Res. Asst., EECS<\/li>\n<li>C. GoGwilt, Res. Asst., EECS<\/li>\n<li>J. Lee, Res. Asst., EECS<\/li>\n<li>J. Johnson, Res. Asst., EECS<\/li>\n<li>L. Yu, Res. Asst., EECS<\/li>\n<\/ul>\n<h3>Support Staff<\/h3>\n<ul>\n<li>M. Whiting, Admin. Asst. II<\/li>\n<\/ul>\n<h3>Publications<\/h3>\n<p>W. Fan, D. Boning, L. Charns, H. Miyauchi, H. Tano, and S. Tsuji, \u201cStudy on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-level CMP Model,\u201d <span style=\"text-decoration: underline;\">J. Electrochem. Soc.<\/span>, vol. 157, no. 5, pp. H526-H533, May 2010.<\/p>\n<p>H. Taylor, M. Hale, Y. C. Lam, and D. Boning, \u201cA method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers,\u201d <span style=\"text-decoration: underline;\">J. Micromechanics and Microengineering<\/span>, vol. 20, no. 6, p. 065001, June 2010.<\/p>\n<p>H. Taylor, Y. C. Lam, and D. Boning, \u201cAn investigation of the detrimental impact of trapped air in thermoplastic micro-embossing,\u201d <span style=\"text-decoration: underline;\">J. Micromechanics and Microengineering<\/span>, vol. 20, no. 6, p. 065014, June 2010.<\/p>\n<p>N. Drego, A. Chandrakasan, D. Boning, and D. Shah, \u201cReduction of Variation-Induced Energy Overhead in Multi-core Processors,\u201d <span style=\"text-decoration: underline;\">IEEE Trans. on Computer-Aided Design<\/span>, vol. 30, no. 6, pp. 891-904, June 2011.<\/p>\n<p>H. Taylor, K. Smistrup, and D. Boning, \u201cModeling and simulation of stamp deflections in nanoimprint lithography: exploiting backside grooves to enhance residual layer thickness uniformity,\u201d <span style=\"text-decoration: underline;\">Microelectronic Engineering<\/span>, vol. 88, no. 8, pp. 2154-2157, August 2011.<\/p>\n<p>H. Taylor, D. Boning, and C. Iliescu, \u201cA razor-blade test of the demolding energy in a thermoplastic embossing process,\u201d <span style=\"text-decoration: underline;\">Journal of Micromechanics and Microengineering<\/span>, vol. 21, no. 6, p. 067002, June \u00a02011.<\/p>\n<p>R. K. Jena, H. K. Taylor, Y. C. Lam, D. S. Boning, and C. Y. Yue, \u201cEffect of polymer orientation on pattern replication in a micro-hot embossing process: experiments and numerical simulation,\u201d <span style=\"text-decoration: underline;\">Journal of Micromechanics and Microengineering<\/span>, vol. 21, no. 6, p. 065007, June\u00a0 2011.<\/p>\n<p>H. Taylor, K. Smistrup, and D. Boning, \u201cModeling and simulation of stamp deflections in nanoimprint lithography: exploiting backside grooves to enhance residual layer thickness uniformity,\u201d <span style=\"text-decoration: underline;\">36<sup>th<\/sup> International Conference on Micro &amp; Nano Engineering (MNE2010)<\/span>, Genoa, Sept. 2010.<\/p>\n<p>W. Fan, J. Johnson, and D. S. Boning, \u201cNon-Ohmic Wafer-Level Modeling of Electrochemical-Mechanical Planarization (ECMP),\u201d <span style=\"text-decoration: underline;\">International Conference on Planarization Technology (ICPT)<\/span>, Phoenix, AZ, Oct. 2010.<\/p>\n<p>D. Boning, A. Kahng, H. Taylor, and Y.-K. Wu, \u201cChip-Scale Simulation of Residual Layer Thickness Uniformity in Thermal Nanoimprint Lithography: Evaluating Stamp Cavity-Height and \u2018Dummy-Fill\u2019 Selection Strategies,\u201d <span style=\"text-decoration: underline;\">9<sup>th<\/sup> International Conference on Nanoimprint and Nanoprint Technology (NNT),<\/span> Copenhagen, Denmark, Oct. 2010.<\/p>\n<p>H. Taylor, K. Simstrup, and D. Boning, \u201cModeling the Enhancement of Nanoimprint Stamp Bending Compliance by Backside Grooves: Mitigating the Impact of Wafer Nanotopography on Residual Layer Thickness,\u201d <span style=\"text-decoration: underline;\">9<sup>th<\/sup> International Conference on Nanoimprint and Nanoprint Technology (NNT),<\/span> Copenhagen, Denmark, Oct. 2010.<\/p>\n<p>J. O. Diaz, H. K. Taylor, R. J. Shul, R. L. Jarecki, T. M. Bauer, D. S. Boning, and D. L. Hetherington, \u201cA Computationally Simple, Wafer-to-Feature-Level Model of Etch Rate Variation in Deep Reactive Ion Etching,\u201d <span style=\"text-decoration: underline;\">AVS 57<sup>th<\/sup> International Symposium &amp; Exhibition<\/span>, Albuquerque, NM, Oct. 2010.<\/p>\n<p>K. Balakrishnan, K. Jenkins, and D. Boning, \u201cA Simple Array-Based Test Structure for the AC Variability Characterization of MOSFETs,\u201d <span style=\"text-decoration: underline;\">IEEE International Symposium on Quality Electronic Design (ISQED)<\/span>, March 2011.<\/p>\n<p>A. H. Chang, D. Boning, and H.-S. Lee, \u201cRedundancy in SAR ADCs,\u201d <span style=\"text-decoration: underline;\">Great Lakes Symposium on Very Large Scale Integration (GLSVLSI)<\/span>, Lausanne, Switzerland, May 2011.<\/p>\n<p>K. Balakrishnan, K. A. Jenkins, and D. Boning, \u201cA Ring Oscillator-Based Test Structure for AC Variability Characterization of Individual MOSFETs,\u201d <span style=\"text-decoration: underline;\">2<sup>nd<\/sup> European Workshop on CMOS Variability (VARI)<\/span>, 4 pages, Grenoble, France, May 2011.<\/p>\n<p>Fan, W., J. Johnson, and D. Boning, \u201cWafer-level Modeling of Electrochemical-Mechanical Planarization (ECMP),\u201d <span style=\"text-decoration: underline;\">International Conference on Planarization Technology (ICPT)<\/span>, Phoenix, AZ, Oct. 2010.<\/p>\n<p>W. Fan, D. Boning, Y. Zhuang, Y. Sampurno, A. Philipossian, D. Hooper, and M. Moinpour, \u201cCharacterization of CMP Pad Surface Properties,\u201d <span style=\"text-decoration: underline;\">Clarkson Workshop on Chemical-Mechanical Polishing<\/span>, Lake Placid, NY, Aug. 2010.<\/p>\n<p>D. Boning, A. H. Chang, K. Zuo, J. Wang, and D. Yu, \u201cTest Structures, Circuits, and Extractions Methods for Determining Pattern Density Effects,\u201d <span style=\"text-decoration: underline;\">IEEE\/ACM Workshop on Variability Modeling and Characterization (VMC)<\/span>, San Jose, CA, Nov. 11, 2010.<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Design for manufacturability (DFM) of processes, devices, and integrated circuits. Characterization and modeling of variation in semiconductor and MEMS manufacturing, with emphasis on chemical-mechanical polishing (CMP), electroplating, plasma etch, and embossing processes.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[80],"tags":[44],"_links":{"self":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/posts\/3806"}],"collection":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/comments?post=3806"}],"version-history":[{"count":7,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/posts\/3806\/revisions"}],"predecessor-version":[{"id":4028,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/posts\/3806\/revisions\/4028"}],"wp:attachment":[{"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/media?parent=3806"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/categories?post=3806"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/wp-json\/wp\/v2\/tags?post=3806"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}