{"id":3122,"date":"2011-06-28T15:56:21","date_gmt":"2011-06-28T15:56:21","guid":{"rendered":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/?p=3122"},"modified":"2011-07-19T20:13:11","modified_gmt":"2011-07-19T20:13:11","slug":"experiment-and-simulation-on-channel-mobility-of-in0-53ga0-47as-quantum-well-mosfet-structures","status":"publish","type":"post","link":"https:\/\/mtlsites.mit.edu\/annual_reports\/2011\/experiment-and-simulation-on-channel-mobility-of-in0-53ga0-47as-quantum-well-mosfet-structures\/","title":{"rendered":"Experiment and Simulation on Channel Mobility of In0.53<\/sub>Ga0.47<\/sub>As Quantum-well MOSFET Structures"},"content":{"rendered":"

This paper discusses a way to optimize the In0.53<\/sub>Ga0.47<\/sub>As quantum-well MOSFET structures from the prospective of channel mobility. We experimentally demonstrated that the barrier thickness and interfacial defect density are two key factors determining the channel mobility, while the effect of the oxide charge is negligible. The mobility model consisting of phonon scattering and coulomb scattering was applied to fit the experimental data. According to the model, for quantum-well MOSFET structures with in-situ<\/em> ALD Al2<\/sub>O3<\/sub>, the mobility is dominated by coulomb scattering for the thin barrier case (<5 nm) and dominated by phonon scattering for the thick barrier case (>5 nm). At a barrier thickness of 4 nm, compared to a structure with in-situ<\/em> ALD Al2<\/sub>O3<\/sub> with the mobility of 6807 cm2<\/sup>\/Vs, which corresponds to an interfacial charged defect density of 1.1×1013<\/sup> cm-2<\/sup>, the structure with in-situ<\/em> CVD Al2<\/sub>O3<\/sub> showed higher mobility (8883 cm2<\/sup>\/Vs), which corresponds to a lower charged defect density (5×1012<\/sup> cm-2<\/sup>).<\/p>\n\n\t\t