{"id":930,"date":"2010-06-28T15:40:10","date_gmt":"2010-06-28T19:40:10","guid":{"rendered":"https:\/\/wpmu2.mit.local\/?p=930"},"modified":"2010-06-28T15:40:10","modified_gmt":"2010-06-28T19:40:10","slug":"cmp-slurry-abrasive-particle-agglomeration-modeling","status":"publish","type":"post","link":"https:\/\/wpmu2.mit.local\/cmp-slurry-abrasive-particle-agglomeration-modeling\/","title":{"rendered":"CMP Slurry Abrasive Particle Agglomeration Modeling"},"content":{"rendered":"
In this work we propose a particle-agglomeration model for CMP, to understand the creation and behavior of agglomerated slurry abrasive particles arising during the CMP process. Slurry agglomeration is a major cause of defectivity, as well as poor consumable utility due to sedimentation [1<\/a>]<\/sup> [2<\/a>]<\/sup> [3<\/a>]<\/sup>. Our approach goes beyond prior slurry abrasive-particle-modeling attempts, which have focused on qualitative correlations [4<\/a>]<\/sup>, empirically assumed relationships of those correlations on particle size distributions [5<\/a>]<\/sup>, or quantitative correlations of purely mechanistic behavior of agglomerated particles, without considering chemical effects [2<\/a>]<\/sup> [6<\/a>]<\/sup>.<\/p>\n