{"id":2078,"date":"2010-07-14T13:10:28","date_gmt":"2010-07-14T17:10:28","guid":{"rendered":"https:\/\/wpmu2.mit.local\/?p=2078"},"modified":"2010-07-19T12:07:43","modified_gmt":"2010-07-19T16:07:43","slug":"active-photonics-in-a-cmos-platform","status":"publish","type":"post","link":"https:\/\/wpmu2.mit.local\/active-photonics-in-a-cmos-platform\/","title":{"rendered":"Active Photonics in a CMOS Platform"},"content":{"rendered":"
Although the majority of silicon photonic research is motivated by end applications where photonic devices can be integrated alongside millions of transistors, most research devices are fabricated in independent photonics-only process flows. Free from the constraints of working within an existing process, fabrication steps and layer geometries have been tailored to optimize the performance of individual devices. The short-flow methodology has enabled pioneering device research and proof-of-concept demonstrations by many academic and industrial groups [1<\/a>]<\/sup>. The rapid progress in this work helped to lay the groundwork for the demonstration of a complete electronic-photonic integrated circuit (EPIC) platform by modifying a 130-nm SOI-CMOS platform to accommodate the required fabrication steps [2<\/a>]<\/sup>. Today, however, prominent EPIC applications from multiprocessor interconnect [3<\/a>]<\/sup> to coherent-communication receivers [4<\/a>]<\/sup> require photonic devices to be integrated alongside the dense, high-performance transistors available only within state-of-the-art electronic processes. Recently, localized substrate-removal technology has enabled photonic device integration through the addition of a single post-fabrication step on designs fabricated in unmodified state-of-the-art CMOS electronic foundries [5<\/a>]<\/sup>. By sharing all in-foundry processes, EPICs including state-of-the-art transistors can leverage the existing infrastructure and economy of scale provided by the orders-of-magnitude-larger electronics industry. The major constraint is to adapt the photonic device designs to be manufacturable within the existing process. This challenge is illustrated by comparing the scaled CMOS lateral p-i-n diode shown in Figure 1a to existing p-i-n diodes used as modulators within traditional silicon photonics processes shown in Figure 1b-d. Although the diode formed is electrically suitable for use as a carrier-injection modulator, the slab geometry does not allow for lateral optical confinement away from the optically-lossy electrical contacts. Therefore, novel diode design, perhaps including non-uniform patterning in the direction of propagation, is required to reduce integrate contacts with low optical loss.<\/p>\n